Technology

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Technology Roadmap

Sr. No. Tech. Specifications 2017 2018 2019
1 Layer Count SS-24 L SS-24 L SS-26 L
2 Material CEM-1, CEM-3, FR4, High Tg FR4, Aluminum Substrate Boards CEM-1, CEM-3, FR4, High Tg FR4, Aluminum Substrate Boards CEM-1, CEM-3, FR4, High Tg FR4, Aluminum Substrate Boards
3 Maximum Board Thickness 4.80mm 4.80mm 4.80mm
4 Maximum Board Size 20″ X 23″ 20″ X 23″ 20″ X 23″
5 Minimum Hole Size 0.15mm 0.15mm 0.13mm
6 Laser Drill 0.10mm 0.075mm 0.075mm
7 PTH Tolerance +/- 0.05 mm +/- 0.05 mm +/- 0.05 mm
8 Aspect Ratio 10:01 12:01 12:01
9 Outer Layer Copper Thickness 6.0 oz 6.0 oz 8.0 oz
10 Inner Layer Copper Thickness 6.0 oz 6.0 oz 8.0 oz
11 Minimum Line Width 0.10mm 0.075mm 0.075mm
12 Minimum Inner Core Thickness 0.10mm 0.075mm 0.075mm
13 BGA Pitch 0.80mm 0.60mm 0.50mm
14 Surface Finish HASL, Lead-free HASL, Imm Silver, Imm Gold, Flash Gold, Carbon/Silver Printing, High Temp. OSP, Imm Tin HASL, Lead-free HASL, Imm Silver, Imm Gold, Flash Gold, Carbon/Silver Printing, High Temp. OSP, Imm Tin HASL, Lead-free HASL, Imm Silver, Imm Gold, Flash Gold, Carbon/Silver Printing, High Temp. OSP, Imm Tin
15 Etch Tolerance 0.5 oz Copper Thickness +/- 0.025mm +/- 0.175mm +/- 0.125mm
16 Etch Tolerance 2 oz Copper Thickness +/- 0.08 mm +/- 0.05mm +/- 0.05mm
17 Solder Dam 0.5 oz Copper 0.10 mm 0.075mm 0.075mm
18 Solder Dam 1 oz Copper 0.10mm 0.075mm 0.075mm
19 Solder Dam 2 oz Copper 0.15mm 0.1mm 0.1mm