HDI (High Density Interconnect)

HDI PCBs Provide More Functionality in Compact Areas

HDI is one of the fastest growing technologies in the PCBs industry. HDIs use a combination of blind and buried vias and microvias in a compact space.

 

Benefits of HDI PCBs:

  • Improved electrical performance with lower power consumption thereby improving signal performance
  • HDI boards are smaller in size than traditional boards while providing more functionality.
  • Circuitronix offers a variety of filled microvias
  • Circutronix’s in house surface finishing supports all industry-wide surfaces finishes for HDI boards
Item Description Common Capability Advance Capability
1 Laser drill hole Diameter for micro via 0.004″(0.102mm) 0.003″ (0.075mm)
2 Stacked and deep micro vias 0.004″(0.102mm) 0.003″ (0.075mm)
3 Via in pad YES YES
4 Micro Via pad size 0.012″(0.30mm) 0.010″(0.25mm)
5 Dielectric thickness for Laser via 0.003″ (0.075mm) 0.002″(0.05mm)
6 Micro Via Pitch 0.016″(40mm) 0.014″(0.35mm)
7 Buried Hole Size 0.008″(0.20mm) 0.006″(0.15mm)
8 Buried Hole Pad Size 0.020″(0.50mm) 0.018″(0.45mm)
9 Inner Layer Trace Width 0.004″(0.10mm) 0.003″(0.075mm)
10 Inner Layer Trace Spacing 0.004″(0.10mm) 0.003″(0.075mm)
11 Outer Layer Trace Width 0.004″(0.10mm) 0.003″(0.075mm)
12 Outer Layer Trace Spacing 0.004″(0.10mm) 0.003″(0.075mm)