HDI (High Density Interconnect)

One of the fastest growing technology in PCBs. They use a combination of blind / buried via and microvias as well.

More functionality in compact areas

  • HDI offers improved electrical performance with lower power consumption improving signal performance
  • HDI boards are smaller in size giving more functionality
  • Circuitronix offers copper or risen filled microvias
  • Circutronix supports all industry wide surfaces finishes for HDI boards in house
Item Description Common Capability Advance Capability
1 Laser drill hole Diameter for micro via
0.004"(0.102mm)
0.003" (0.075mm)
2 Stacked and deep micro vias 0.004"(0.102mm) 0.003" (0.075mm)
3 Via in pad YES YES
4 Micro Via pad size 0.012"(0.30mm) 0.010"(0.25mm)
5 Dielectric thickness for Laser via 0.003" (0.075mm) 0.002"(0.05mm)
6 Micro Via Pitch 0.016"(40mm) 0.014"(0.35mm)
7 Buried Hole Size 0.008"(0.20mm) 0.006"(0.15mm)
8 Buried Hole Pad Size 0.020"(0.50mm) 0.018"(0.45mm)
9 Inner Layer Trace Width 0.004"(0.10mm) 0.003"(0.075mm)
10 Inner Layer Trace Spacing 0.004"(0.10mm) 0.003"(0.075mm)
11 Outer Layer Trace Width 0.004"(0.10mm) 0.003"(0.075mm)
12 Outer Layer Trace Spacing 0.004"(0.10mm) 0.003"(0.075mm)