Layers
Max.
Panel Size
Max Outer Layer Copper Thickness
Max Inner Layer Copper Thickness
Min. Line/Width Spacing
Min. Finished Hole Size
Aspect Ratio
SolderMask
S/M Plug Hole
PTH tolerance
NPTH tolerance
Min. Board Thickness
Max Board Thickness
Blind and Buried Vias
Impedance Control
Laminate Tg
Finish
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One to Twenty Layers
22"X"36"
6 oz.
3 oz.
3mil/3mil
0.008" (0.20mm)
10:1
LPI and DryFilm
0.028" (0.7mm)
+1mil/-2mil; +2mil/-1mil
+/- 1mil
0.004"
0.236"(6mm)
50, 60, 70 ohm+/- 10%
Yes
Upto 200 deg C
HASL
Flash Gold (<3 microinches)
Immersion Gold (5-10 microinches)
40-50 microinches of soft gold thermosonic
gold bonding
Entek Cu (106)
Edge Connector Gold Plating
Carbon Printing/Trmming
Silver Cross Over Technology
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